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Senior Mechanical Hardware Design Engineer, IC Product

Nvidia · Israel · On-site · Posted yesterday

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About the job

NVIDIA is looking for a HW Mechanical Engineer to join the IC Product Engineering HW team. You will lead the mechanical design and execution of test hardware for NVIDIA’s networking and CPO (Co-Packaged Optics) products: test boards, sockets, handler interfaces, system-level test (SLT) mechanical interfaces, and HTOL platforms. NVIDIA’s Networking division is a leading supplier of end-to-end InfiniBand and Ethernet connectivity solutions for data centers, including adapter cards, switches, cables and software. Our products deliver industry-leading bandwidth, performance and scalability. The IC PE HW team ensures these products are tested and qualified for high-volume production. What you’ll be doing: • Design, define and qualify test sockets, contactors, handler change kits and thermal solutions for high-power, high-speed devices, with full ownership of the mechanical specification, mechanical component selection, and mechanical constraints for board layout (keep-out zones, placement, stiffening). Manage the external vendors who supply them, including drawing reviews and design sign-off. • Lead lab bring-up and debug, and define the thermal and mechanical constraints of test platforms so they deploy efficiently and robustly on the production floor, while meeting high-speed signal integrity requirements. • Work with the most advanced ATE platforms in the industry, including Teradyne UltraFLEX / UltraFLEXplus and Advantest V93K testers and probers. • Develop mechanical interfaces for optical systems on production ATE equipment, and define new design concepts for future CPO products. • Collaborate with R&D and Production teams: board design, system-level test, signal integrity, layout, firmware and test engineering. • Lead HTOL (High-Temperature Operating Life) hardware platforms for reliability testing. What we need to see: • B.Sc. in Mechanical Engineering. • 5+ years of experience as a Mechanical Design Engineer, with hands-on 3D CAD (Creo preferred) • Proven ownership of projects end-to-end, with the ability to work independently and drive multiple projects and vendors in parallel. • Understanding of digital circuits, power delivery and high-speed design constraints as they affect mechanical design. • Strong personal skills: self-learner, multi-disciplinary, able to multitask, with excellent interpersonal skills. Ways to stand out: • working alongside a board design team. • System-level understanding and familiarity with production environments (SLT and final test). • Hands-on experience with test sockets (pogo pin, coax), ATE handlers, and thermal control (tri-temp). • Experience with high-power, large-body BGA packages, and with thermal analysis or simulation. • Experience with optical or fiber interfaces in a test setup. • Experience managing external mechanical vendors and tooling suppliers, including reviewing and approving manufacturing drawings. • Strong GD&T and tolerance stack-up skills. • Experience with HTOL, burn-in or other reliability test hardware. • Ability to mentor junior engineers.

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